Hardware

Beschleunigen Sie Ihre IoT-Entwicklung!

Der Schlüssel zum perfekten IoT-Device, das optimal mit unseren Netzen zusammenarbeitet, liegt in der Auswahl des Richtigen Mobilfunkmoduls. Wir investieren, um Ihnen den größten Katalog von Netzbetreiber-zertifizierten Modulen der Branche zu präsentieren. Mit unserer großen Auswahl zertifizierter Module ermöglichen wir unseren Kunden größtmögliche Flexibilität, kürzere time-to-market und reduzierte Kosten bei der Validierung und Zertifizierung ihres Endprodukts.

Advantech

WISE-1570

• ARM Cortex-M4
• Core Processor Compliant with 3GPP^TM Rel.14 NB-IoT standard
• Integrated with WISE-PaaS/RMM & MBED Cloud Service
• Rich interface for sensor and I/O control
• Support wide temperature: -40°C to 85°C

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AI-Link

AI-NB25

• Low cost through high integration combining MCU, PMU, Flash, RAM, DSP, RF, and other units in one module
• Small size combined with rich peripheral interface
• Global band support for worldwide products (617 MHz to 2.2 GHz)
• Low power consumption (~3uA in PSM)
• Operating temperature range of -40°C to 85°C

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Astrocast

Astronode S

• Low-cost satellite connectivity network providing the highest value for money in the market
• Miniaturized patch antennas enabled by L-Band spectrum
• Discrete antennas with better performance
• Two-way communications – send instructions to your device as well as collecting data from your device
• Ultra-low power terminals – 0.35 Watt at transmission, enabling 10 years maintenance-free operation

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Cheerzing

ML5515

• Support for LTE Cat.NB2
• Available in LCC+LGA form factor with integrated eSIM solution.
• 6-band support for regional deployments
• Firmware over the Air updates via LwM2M

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ML5535-G8

• Ultra-Small: 16 x 18 x 2.55 mm³
• LCC package
• Ultra-low sleep power
• Extended temperature range: -35°C to +75°C at full performance, -40°C to +85°C at reduced performance

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Compal

RML-E1

• 3G/LTE/5G Cat.19 LGA module based on the Mediatek T750 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between LTE and 5G

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RXM-G1

• 3G/LTE/5G Cat.20 M.2 module based on the Qualcomm SDX55 Cortex-A7 chipset
• Both 5G modes: NSA and SA supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between LTE and 5G

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Fibocom

FG150-AE

• 5G/LTE CAT-16 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world
• Downlink MIMO, carrier aggregations 3CA
• 5G SA / NSA network architecture support

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FG621-EA

• LGA form factor wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• The high speed Cat.6 module can reach up to 400Mbps DL and 50Mbps UL
• It can be widely used in CPE and STB gateway industry
• Can cover EMEA/APAC/Australian mobile networks

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FM101-GL-00

• 3G/LTE Cat.6 M.2 module based on the Qualcomm SDX12-2 chipset
• Supports a wide range of supported 3G/LTE frequency bands commonly used in many different regions of the world
• The high speed LTE Cat.6 module can reach up to 300Mbps DL and 50Mbps UL
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

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FM101-GL-12

• 3G/LTE Cat.12 M.2 module based on the Qualcomm SDX12-0 chipset
• Supports a wide range of supported 3G/LTE frequency bands commonly used in many different regions of the world
• The high speed LTE Cat.12 module can reach up to 600Mbps DL and 150Mbps UL
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

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FM150-AE

• 5G/LTE CAT-16 M.2 data card module based on the SDX55 Qualcomm chipset.
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world.
• Downlink MIMO, carrier aggregations 3CA.
• 5G SA / NSA network architecture support.

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FM150-AE-21

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregation
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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FM350-GL

• 5G/LTE Cat.19 M.2 data card module based on the Mediatek M70 family chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregation
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, QZSS, and Galileo satellite systems supported)
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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L610-EU

• 2G / LTE Cat.1bis module optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Support for frequency bands of major operators in Europe
• VoLTE support
• Pin design is compatible with NL668 series / L716 series
• Ideal for medium and low rate communication solution

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L610-EU-MiniPCIe

• 2G / LTE Cat.1bis module optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Support for frequency bands of major operators in Europe
• VoLTE support
• Pin design is compatible with NL668 series / L716 series
• Ideal for medium and low rate communication solution

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L850-GL

• M.2 form factor high-end LTE wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• Multiple CA band combinations
• The high speed Cat.9 module can reach up to 450Mbps DL and 50Mbps UL
• Can be widely used in consumer electronics and gateway industry

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L860-GL

• M.2 form factor high-end LTE wireless communication module
• LTE-FDD/LTE-TDD/WCDMA support
• Multiple CA band combinations
• The high speed Cat.16 module can reach up 1 Gbps DL and 75Mbps UL
• Can be widely used in consumer electronics and gateway industry

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L860-GL-16

• LTE Cat.16 M.2 data card module based on the Intel XMM7560 chipset
• Supports a wide range of supported LTE frequency bands commonly used in many different regions of the world
• Downlink MIMO, Carrier Aggregation 5CA Downlink and 2CA Uplink IntraBand
• 3GPP Rel.12 compatible
• Industry-standard design (42 mm x 30 mm x 2.3 mm)
• Widely used in consumer electronics, such as laptops, tablets, and gateway industries

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M910-GL

• Multimode, multi-band module with LTE-M (eMTC) + NB1 + EGPRS
• Power Saving Features, including 10 microAmps PSM mode
• Extended protocol support: PPP / TCP / UDP / FTP(S) / HTTP(S) / PING / NITZ
• Device Management over DFOTA, LwM2M

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MA510-GL-00

• Tri-mode for the global market: LTE Cat-M1/Cat-NB2/EGPRS
• Reliable and stable data transmission with ultra-low power consumption
• Global certifications
• Compatible with Fibocom 510-Series modules, easy for future upgrading

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N510 (N510-EAU-00)

• Power saving features for extended battery life: PSM (less than 3.0uA) and eDRX
• Supports Release Assistance Indicator (RAI) to reduce power consumption
• Native support for multiple protocols, including IPV4, IPV6, CoAP, LwM2M
• Support for firmware updates via FOTA

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N510-GL

• Compact LCC+LGA form factor 22.2 mm x 20.2 mm x 2.1 mm
• Broad protocol support: TCP/UDP, IPv4/IPv6, CoAP, LWM2M
• Advanced power saving features for long battery life: PSM, eDRX
• Device management using firmware over the air (FOTA)

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NL668-EAU

• GNSS support
• Multimode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP protocol stacks
• Embedded FTP/HTTP protocols
• USB 2.0 support
• 3GPP^TM Rel.9

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NL668-EAU Mini PCIe

• GNSS support
• Multimode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP protocol stacks
• Embedded FTP/HTTP protocols
• USB 2.0 support
• 3GPP^TM Rel.9

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NL668-EU

• 3GPP^TM Rel.9 LTE Cat.4 module packaged in a LCC form factor
• Supports mulitple LTE FDD, WCDMA, and GSM frequency bands
• Embedded GNSS
• Integrated TCP/UDP stack, with support for FTP/HTTP
• USB 2.0

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NL668-EU MiniPCIe

• 3GPP^TM Rel.9 LTE Cat.4 module packaged in a miniPCIe form factor
• Supports mulitple LTE FDD, WCDMA, and GSM frequency bands
• Embedded GNSS
• Integrated TCP/UDP stack, with support for FTP/HTTP
• USB 2.0

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Goldenberg

DTN256

• Supports 3GPP^TM Rel.14 NB-IoT standard, in four frequency bands (B1, B3, B5, and B8)
• Compact size (17.6 x 15.7 x 2.3 mm) meets dimensional requirements of most products
• Fulfills M2M requirements making it suitable for portable services, security systems, wireless POS devices, industrial quality PDAs, smart watches, total remote controls, etc.
• Wide range of physical interfaces, including 42-pin SMT, bidirectional serial connector (3-wire serial connector and one full-function serial connector), and UART

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GosuncnWelink

ME3616

• Ultra-low package NB-IoT 3GPP^TM Rel.13 module with LCC form factor
• Optimized low power working mode with PSM and eDRX power saving features
• eSIM support for mobility and lower power consumption
• Support for multiple protocols including CoAP, TCP/UDP, MQTT, OMA-LwM2M, oneNET

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ME3630 LCC

• GNSS support
• Multi-mode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP
• Embedded FTP/HTTP
• Supports 3GPP Rel. 10
• Pin-to-pin 30x30 LCC compatibility

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ME3630 mPCI

• GNSS support
• Multi-mode LTE FDD & WCDMA &GSM
• Embedded TCP/UDP
• Embedded FTP/HTTP
• Supports 3GPP Rel. 10
• Pin-to-pin mPCI adapter standard compatibility

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Hothink

AN150A

• Compact-sized NB-IoT module, with ultra-low power consumption and super-high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

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Huawei

ME909s-120

• Cost-effective, lower-power LTE/UMTS/GSM connectivity optimized for broadband IoT applications
• Designed for industrial-grade M2M applications such as vehicle telematics, tracking, mobile payment, industrial router, safety monitor, and industrial PDAs
• Enhanced features like FOTA, USSD, IPV6/IPV4, and Huawei enhanced AT commands
• Extended operating temperature: -40°C to +85°C

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Kinéis

KIM 1

• Kinéis offers a unique combination of cost effective and miniaturized technology enabling customers to get visibility over their assets worldwide regardless of the application
• Module dedicated for global IoT connectivity
• Low power transmitter module optimized for battery powered solutions
• CE marking and fully certified by Kinéis and CNES (French Space Agency)
• Kinéis enhanced AT commands on UART interface

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lierda

NB08-01

• Based on the 3GPP^TM-compliant HiSilicon BoudicaV120 chipset platform
• Compact size for ultra-low power consumption
• Support for deep indoor coverage
• Jamming protection implemented

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NB86-G

• Ultra-small size NB-IoT module, 20 x 16 x 2.2 mm³
• Supports 3GPP^TM Rel.14 NB-IoT air interfaces and protocols
• Ultra-low power consumption
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Operating Temp Range of -30°C to 85°C
• CoAP over UDP/IP
• GSMA TS.34 communication efficiency enhancements (Radio Policy Manager)

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MeiG Smart Technology

SLM156

• Support NB-IoT/LTE-M/EGPRS modes
• Support Rel.14 LTE Cat.M1 & NB2
• LCC package with ultra-compact size
• Extremely low power consumption
• Industrial-level temperature range
• Embedded Internet service protocols
• Fast time to market; reference designs and timely technical support to accelerate the customer’s development
• Basic functions to suit M2M wide range of applications

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Mobiletek

L620

• LCC package, with stable and reliable performance
• Supports low/mid/high bands
• Small size and very convenient for SMT
• Meet the needs of customers for small module products and can be widely used for various products and equipment of IoT

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Murata

Type 1RX

• LTE Category: NB-IoT Rel.13,14
• Chipset: HiSilicon Hi2115
• Interface: UART/I2C/ADC/GPIOs
• Built-in ARM^® Cortex^® M0 core with 64KB SRAM & 256KB flash
• Operating Temp: -30°C to +85°C

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Type 1SC

• Small form factor (11.1 mm x 11.4 mm x 1.4 mm)
• Power consumption enables up to 10 year battery life hibernation
• OTA firmware upgrade
• OMA Lightweight M2M (LwM2M)
• Control via AT commands according to 3GPP^TM TS27.005, 27.007, and customized AT commands
• Carrier certifications: PTCRB (5.38), GCF (3.73)

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Type 1SC-DM

• Small form-factor (11.1 x 11.4 x 1.4 mm)
• Power consumption enables up to 10-year battery life hibernation
• OTA firmware upgrades supported
• OMA Lightweight M2M (LwM2M)
• Control via AT commands according to 3GPP^TM TS27.005, TS27.007, and customized AT commands
• Carrier Certifications: PTCRB (5.38), GCF (3.73)

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Type 1SS

• LTE Category: NB-IoT Rel.13,14
• Chipset: Mediatek MT2625
• Interface: UART/SPI/GPIO
• Built-in ARM^® Cortex^® M4 156MHz core with 4MB SRAM & 4MB flash
• Operating Temp: -40°C to +85°C

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Type 1YS

• Certified as a modem for ease of integration with several different types of applications
• Ultra small form factor, only 13.2 mm x 10.6 mm x 1.8 mm
• Low power consumption (3.3μA in PSM) enables up to 10 years of battery life
• Ideal for water and gas meters, industrial IoT and asset tracking

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Neoway

N20

• High-performance, ultra-low power consumption NB-IoT / Cat.M1 / EDGE module
• LCC package with compact size perfectly suited for applications with strict size requirement
• Supports GNSS and various hardware interfaces for easy development
• Well applicable to IoT communications devices requiring low speed and low power consumption
• Neoway enhanced AT commands

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N21

• The world's smallest NB-IoT module in LGA package, perfect for applications with strict size requirements
• High-performance, ultra-low power consumption
• Compliant to 3GPP^TM Release 13, software upgradable to Release 14
• Embedding Neoway Extended AT commands
• Supporting Enhanced PSM function for fast data recovery
• Supporting FOTA upgrade for remote firmware update
• Optimal for IoT devices that requires a low speed and low power consumption

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N27

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Integrated RAM and flash in baseband chipset
• Supports global frequency bands by one BOM
• Rich interfaces, high reliability
• Professional reference design, evaluation kits and timely technical support to help customers quickly complete product development

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Nordic

nRF9160

• Multimode NB-IoT and Cat-M1 with GPS
• Dedicated application domain with ARM Cortex-M33 CPU, 1MB of memory and rich peripheral set
• Open Source Software Development Kit (SDK) shared with Nordic’s nRF5 Bluetooth products
• Global LTE band support
• Ultra-Low Power design for cellular IoT applications
• Extended temperature range of -40°C to +85°C

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Notion

MW29

• Rich resources with motor driver and eSIM inside
• Support for 24 bit differential ADC
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

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OT01-3

• Rich resources with motor driver
• Support for 10 bit single ADC
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

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OT01-5

• Rich resources with motor driver and eSIM inside
• Support for 24 bit differential ADC and rich GPIO
• Customized device management platform
• Suitable for water/gas meters, smart smoke detectors, smart home, smart city applications

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Quectel

BC65

• Power saving design ensures ultra-low power consumption
• Specialized PSM_EINT for easy module wake-up via external interrupt
• Built-in eSIM reserved
• Multi-band and rich external interfaces ensuring convenient application
• Compatible with Quectel GSM/GPRS M66, NB-IoT BC66, BC66-NA and BC68 modules, easy for future upgrading and migration
• Embedded with abundant Internet service protocols

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BC66

• Compact NB-IoT module with ultra-low power consumption
• Low power supply voltage: 2.1V~3.63V
• Support high speed movement (80~120km/h)
• OpenCPU solution minimizes application design
• Specialized PSM_ENIT for easy module wake-up via external interrupt
• Build-in eSIM reserved
• Multi-band and rich external interfaces ensure convenient application
• Compatible with Quectel GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols

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BC66-NA

• Compact, 3GPP^TM Rel. 14 NB2 LPWA module with ultra-low power consumption
• Support for radio frequency bands B1, B2, B3, B4, B5, B8, B12, B13, B17, B18, B19, B20, B25, B28, B66, B71, B85
• Low power supply voltage: 2.1 - 3.63 V
• QuecOpen® solution minimizes application design
• Specialized PSM_EINT for easy module wake-up via external interrupt
• Built-in eSIM reserved
• Multi-band and rich external interfaces ensure convenient application
• Compatible with Quectel GSM/GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols

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BC68

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

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BC92

• NB-IoT/GSM dual-mode module with ultra-low power consumption, compact size and high sensitivity
• Multi-band and rich external interfaces ensuring convenient application
• Compatible with Quectel GSM/GPRS M95 module, NB-IoT BC95-G module and LPWA BG95 module, easy for future upgrading
• Embedded with abundant Internet service protocols

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BC95-B8

• High-performance NB-IoT module with ultra-low power consumption
• Compact-sized LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Multiple serial ports
• Embedded with abundant Internet service protocol
• Quectel enhanced AT commands
• Extended temperature range: -40°C to +85°C

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BC95-B20

• High-performance NB-IoT module with ultra-low power consumption
• Compact-sized LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Multiple serial ports
• Embedded with abundant Internet service protocols
• Quectel enhanced AT commands
• Extended temperature range: -40°C to +85°C

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BC95-G

• Compact-sized multi-band NB-IoT module
• Ultra-low power consumption
• Super high sensitivity
• LCC package makes it easy for large volume manufacturing
• Compatible with Quectel GSM / GPRS module, easy for future upgrading
• Embedded with abundant Internet service protocols
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

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BC660K-GL

• High-performance LTE Cat.NB2 module supporting multiple frequency bands
• Ultra-low cost and power consumption
• Built-in eSIM reserved
• Wide power supply range: 2.2–4.3 V
• Compatible with Quectel GSM/GPRS M66 and NB-IoT BC66 modules for easy upgrades
• Embedded with abundant Internet service protocols
• Multi-band and rich external interfaces ensuring convenient application
• LCC package facilitating large-volume manufacturing

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BG77

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Comprehensive set of hardware-based security features
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

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BG95-M1

• LTE Cat.M1 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

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BG95-M2

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

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BG95-M3

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 5 (21 dBm) maximum output power

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BG95-M3 Mini PCIe

• Multi-band LTE Cat.M1/Cat.NB2/EGPRS module with global coverage
• Standard PCI Express® Mini Card form factor (Mini PCIe) ideal for manufacturers to easily integrate wireless connectivity into their devices
• Easy migration from Quectel LTE Standard Mini PCIe modules
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

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BG95-M4

• LTE Cat.M1/Cat.NB2 module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power in LTE bands B31/B72/B73
• Power Class 5 (21 dBm) maximum output power in remaining LTE bands

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BG95-M5

• LTE Cat .M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power

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BG95-M6

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Compact SMT form factor ideal for size-constrained applications with tight space
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA and LTE modules
• Super slim profile in LGA package
• Integrated RAM and Flash in the baseband chipset
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces
• Power Class 3 (23 dBm) maximum output power

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BG95-MF

• LTE Cat.M1/Cat.NB2/EGPRS module with ultra-low power consumption
• Easy migration from Quectel GSM/GPRS, UMTS/HSPA, and LTE modules
• Integrated RAM and flash in the baseband chipset
• Comprehensive set of hardware-based security features
• Support CS voice* for GSM, QuecOpen®, eSIM, etc.
• Fast time-to-market: reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Compact SMT form factor ideal for size-constrained applications with tight space

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BG96

• LTE Cat.M1/Cat.NB1/EGPRS multimode module with ultra-low power consumption
• Pin-to-pin compatibility for easy migration from Quectel LTE, Cat.NB1, UMTS/HSPA, GSM/GPRS modules
• Compact SMT form factor (26.5mm × 22.5mm × 2.3mm) ideal for size-constrained applications
• Slim profile in LGA package allows fully automated manufacturing for high-volume applications
• Robust mounting and industry-standard interfaces: USB, UART, I2C, Status Indicator
• Fast time-to-market: Reference designs, evaluation tools, timely technical support

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BG600L-M3

• LTE Cat-M1/Cat-NB2/EGPRS module with ultra-low power consumption
• Easy migration from Quectel GSM/GPRS/GNSS module MC60
• Integrated RAM and flash in the baseband chipset
• Comprehensive set of hardware-based security features
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Compact SMT form factor ideal for size-constrained applications with tight space
• Robust mounting and interfaces

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BG770A-GL

• Extremely compact LTE Cat.M1/NB1/NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in LGA package
• Embedded with abundant Internet service protocols
• Supports QuecLocator®, and DFOTA
• A rich set of external, multi-band interfaces that ensure convenient applications
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize time and efforts in design and development
• Robust mounting and interfaces

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BG772A-GL

• Extremely compact LTE Cat.M1/NB1/NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in LGA package
• Embedded with abundant Internet service protocols
• Supports QuecLocator® and DFOTA
• A rich set of external, multi-band interfaces that ensure convenient applications
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize time and efforts in design and development
• Robust mounting and interfaces

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BG950A-GL

• Extremely compact LTE Cat-M1/NB1/ NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in the LGA package
• GPS, GLONASS support
• Embedded with abundant Internet service protocols
• Support for QuecLocator®, and DFOTA
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize time and efforts in design and development

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BG951A-GL

• Extremely compact LTE Cat-M1/NB1/ NB2 module with ultra-low power consumption
• Integrated RAM and flash
• Super slim profile in the LGA package
• Supports GPS, GLONASS, BeiDou, Gallileo, QZSS
• Embedded with abundant Internet service protocols
• Support for QuecLocator®, and DFOTA
• Fast time-to-market: Reference designs, evaluation tools and timely technical support minimize time and efforts in design and development

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EC21-E

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications, worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Release 10 compliant

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EC21-E MiniPCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications, worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Release 10 compliant

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EC21-EC

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC21-EC Mini-PCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Pin-to-pin compatibility thanks to Mini-PCIe port

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EC21-EU

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC21-EU Mini-PCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Pin-to-pin compatibility thanks to Mini-PCIe port

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EC25-E

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• GNSS supported (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)

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EC25-E Mini-PCIe

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• GNSS supported (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)
• Pin-to-pin compatibility thanks to Mini-PCIe port

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EC25-EC

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in LGA package
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC25-EC Mini-PCIe

• Cost-effective, lower-power LTE connectivity-optimized for broadband IoT applications in Mini-PCIe variant
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC25-EU

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC25-EU Mini-PCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC25-EUX

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• LTE Cat 4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: Supports DFOTA, eCall, QuecLocator and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EC25-EUX mini-PCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in universal interface: mini-PCIe package
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Feature refinements: Supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EG06-E

• LTE Advanced Cat.6 module with LGA form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Supports LTE Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EG21-G

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• Extended temperature range of -40°C to +85°C
• Optional GNSS support
• Optional VoLTE support
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)

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EG21-G Mini-PCIe

• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• IPv6 support
• Updating firmware over the air (DFOTA)
• Optional GNSS support (GPS, GLONASS, BeiDou, Galileo, and QZSS)
• Extended temperature range of -40°C to +85°C
• VoLTE support (optional)
• Voice call and SMS (Text/PDU format) support
• Compact design (32.0mm × 29.0mm × 2.4mm)
• Pin-to-pin compatibility thanks to Mini-PCIe port

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EG25-G

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in LGA package
• LTE Cat 4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EG25-G Mini-PCIe

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications in Mini-PCIe variant
• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA, eCall, QuecLocator, and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EG800Q-EU

• LTE Cat 1 module optimized for M2M and IoT applications
• LTE FDD coverage
• Support DFOTA
• Super cost-effective
• LTE module in compact size
• Support Wi-Fi Scan

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EG91-E

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• Multi-band LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Simple migration from 2G/3G to 4G with a flexible and scalable platform
• VoLTE support
• Voice call and SMS (Text/PDU format) support

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EG91-EX

• Cost-effective, lower-power LTE connectivity optimized for broadband IoT applications
• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded power management unit (PMU) featuring ultra-low deep-sleep current consumption
• Feature refinements: supports DFOTA, QuecLocator and DTMF
• Compact SMT form factor ideal for size-constrained applications with extended operation temperature range
• Simple migration from 2G/3G to 4G with a flexible and scalable platform

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EG915U-EU

• LTE Cat 1 module optimized for M2M and IoT applications
• Worldwide LTE, GSM/GPRS coverage
• Abundant functional interfaces
• Support analog audio
• Bluetooth (Optional)
• Wi-Fi Scan (Optional)
• Supports FOTA
• Super cost-effective

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EM06-E

• LTE-Advanced Cat.6 module with M.2 form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment Supports
• LTE-Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems

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EM12-G

• LTE-A Cat.12 module with M.2 form factor, optimized for M2M and IoT applications
• Support DL 3x carrier aggregation and 256QAM
• Worldwide LTE-A and UMTS/HSPA(+) coverage
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Feature refinements: supports DFOTA and DTMF
• MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
• Adopting the 3GPP Rel. 12 LTE technology, it delivers M2M-optimized speeds of 600Mbps downlink and 150Mbps uplink peak data rates

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EP06-E

• LTE-Advanced Cat.6 module with Mini PCIe form factor, optimized for M2M and IoT applications
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Supports LTE-Advanced carrier aggregation
• Worldwide LTE and UMTS/HSPA+ coverage

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M66

• Low-cost device
• Low power comsumption
• BT 3.0 support
• Quad-band 850, 900, 1800, 1900 MHz
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.4 compliant
• Extended temperature range of -40°C to +85°C

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M66-DS

• Low power consumption
• Low cost device
• Extended temperature range of -40°C to +85°C
• Quad-band 850, 900, 1800, 1900 MHz
• BT 3.0 support
• Voice call and SMS (Text/PDU format) support

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M95

• Compact design at 19.9mm x 23.6mm
• Extended temperature range of -40°C to +85°C

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MC60

• Low power consumption
• Low cost device
• BT 3.0 support
• Extended temperature range of -40°C to +85°C
• Quad band 850, 900, 1800, 1900 MHz
• Multi GNSS support (GPS, GLONASS, Galileo, QZSS)
• Supports 3GPP Rel.99/Rel.4
• Voice call and SMS (Text/PDU format) support

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MC60E

• Low power consumption
• Low cost device
• BT 4.0 support (BLE)
• Extended temperature range of -40°C to +85°C
• Quad band 850, 900, 1800, 1900 MHz
• Multi GNSS support (GPS, GLONASS, Gallileo, QZSS)
• Supports 3GPP Rel.4
• Voice call and SMS (Text/PDU format) support

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RM500Q-AE

• 5G sub-6GHz module
• 52.0 mm × 30.0 mm × 2.3 mm, 8.4g
• M.2 form factor
• Max. downlink 2.5Gbps / 900Mbps uplink
• Extended temperature range of -40°C to +85°C

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RM500Q-GL

• 5G sub-6GHz module
• 52.0mm × 30.0mm × 2.3mm, 8.4g
• M.2 form factor
• Maximum Downlink 2.5Gbps / 900Mbps Uplink
• Extended temperature range of -40°C to +85°C

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RM502Q-AE

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC / LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module facilitates the migration and differentiation between 4G LTE and 5G

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RM505Q-AE

• 5G/4G/3G multimode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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RM520N-GL

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both 5G modes: NSA and SA are supported
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Worldwide 5G and LTE-A coverage
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• Feature refinements: DFOTA and VoLTE (optional)

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UC20-G

• Worldwide UMTS/HSDPA+ and GSM/GPRS/EDGE coverage
• GNSS receiver available for applications requiring fast and accurate fixes in any location
• High-quality data and image transmission even in harsh environment
• Robust mounting and interfaces
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts

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UC20-G Mini-PCIe

• Worldwide UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Standard Mini PCIe form factor maximizes the convenience for customers to design and use High-quality data and image transmission even in harsh environment
• High sensitivity GNSS receiver available for applications requiring fast and accurate fixes in any location
• Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

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UG96LA-128-STD

• GSM/UMTS worldwide connectivity
• Penta band UMTS/HSPA
• Super slim profile in LGA package
• Compact SMT form factor for size-constrained applications
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Supports 3GPP^TM Rel.7

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Renesas

RYZ014A

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• Worldwide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

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Ruijie Networks

RG-NB6120

• Improved indoor coverage is provided. In the same frequency band, NB-IoT gains 20dB over the existing GSM network and covers an area that is 100 times larger.
• RG-NB6120 features ultra-low power consumption with a maximum current of less than 5uA in PSM mode.
• In the case of the same base station, NB-IoT can provide 50-100 times more access than existing wireless technologies.
• Compared with LoRa, NB-IoT does not need to be rebuilt, and the radio and antenna are basically multiplexed. Low speed, low power consumption, and low bandwidth also bring low cost advantages to NB-IoT chips and modules.
• The RG-NB6120 supports interfacing with the IoT management platform. Meet the information collection and monitoring needs of the terminal.

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Sequans

GM01Q

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

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GM02S

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA module form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

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Monarch SQN3330-M1

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

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Monarch 2 SQN3430-M1

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

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Sercomm

TPB23

• 20x24mm, LGA 94-pad
• Multiple Band (3, 5, 8, 20...)
• 3GPP^TM Release 13/Release 14
• UART, I2C, GPIO, USIM, ADC, Antenna
• PSM/DRX/eDRX
• IP/UDP/TCP/COAP/LWM2M
• DTLS/DTLS+
• Cell Reselect
• DNS over UDP
• HTTP over TCP
• Non-IP

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Sierra Wireless

EM7455

• 4G/3G multimode module with M.2 form factor
• Optimized for IoT and eMBB applications
• Embedded TCP/IP stack to easily communicate over the internet
• LTE carrier aggregations
• GNSS receiver enables tracking and location-based services

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EM7565

• Supports the latest 4G and 3G networks in North America, Europe, and Asia
• The PCI Express M.2 form factor allows easy integration into smaller and thinner devices
• Optimized for low power consumption
• Ideal for today’s mobile computing, networking, and industrial IoT applications
• Enhance network performance by aggregating licensed and unlicensed spectrum using LTE-LAA, and enable secure and stable private networks using CBRS band
• GNSS tracking lets you locate, monitor, and deploy location-based applications and services with module variants supporting GPS, GLONASS, Beidou, and Galileo satellite systems

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EM9190

• 5G/LTE Cat.20 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink MIMO, ENDC/LTE carrier aggregations
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
• Industrial grade - Tested for harsh environments and extreme temperatures
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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EM9191

• 5G/LTE Cat.20 M.2 data card module based on the SDX55 Qualcomm chipset
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink MIMO, ENDC/LTE carrier aggregations
• Integrated GNSS receiver (GPS, GLONASS, BeiDou, and Galileo satellite systems supported)
• Industrial grade – Tested for harsh environments and extreme temperatures
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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HL6528RD-G

• Common Flexible Form Factor (CF3) interchangeable among 2G, 3G, and 4G technologies
• Future-proof footprint
• Flexible solution in a compact and easy-to-integrate form factor
• Ready-to-use firmware upgrades
• GNSS interface support

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HL7692

• Compact: Smallest 4G/2G form factor on the market
• Future proof: Intelligent pin-to-pin compatibility
• Easy migration to LPWA
• Flexible: Solder down or snap-in socket options
• Tri-band LTE
• Voice call and SMS (Text/PDU format) support with fallback to 2G
• Supports 3GPP^TM Rel.9

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HL7800

• Very small form factor (15 mm x 18 mm x 2.4 mm)
• Global module compatible with all LTE-M & NB-IoT networks
• Best-in-class power consumption supporting PSM, eDRX, etc.
• Optimal 23dBm output power for extended coverage
• Integrated GNSS (GPS/GLONASS) receiver
• Secure Boot and embedded HTTPS and DTLS support
• Free firmware-over-the-air upgrades for future-proof deployments
• Integrated AirVantage® cloud services

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HL7802

• World’s smallest multi-mode LPWA module, offering best-in-class power performance for global LTE-M, NB-IoT, 2G, and GNSS networks
• Fully compliant with the 3GPP^TM Rel.13 standard and is Rel.14 ready to support NB2 features in the future
• Provides a new low-cost, best-in-class power technology for low-bandwidth IoT applications with extended reach beyond traditional cellular
• Delivers up to 300Kbps download speed and 375Kbps upload speed, this module is ideal for simple static sensor applications, or real-time fixed or mobile applications
• Fast time-to-market: Reference designs, evaluation tools, and timely technical support minimize design-in time and development efforts
• Robust mounting and interfaces

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HL8548

• 3G HSPA Penta band module with fall back to 2G GSM/GPRS/EDGE Quad band
• Small form factor (22mm x 23mm) in SMD LGA package, for scalability between 2G, 3G and 4G with the same footprint and core pin layout
• Very low power consumption with separate baseband and PA power supply inputs for extended operational life in battery powered devices
• Integrated support for AirVantage management services, including ready-to-use lifetime firmware upgrades

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HL8548-G

• 3G HSPA Penta band module with fall back to 2G GSM/GPRS/EDGE Quad band
• Integrated GPS+Glonass receiver
• Small form factor (22mm x 23mm) in SMD LGA package, for scalability between 2G, 3G and 4G with the same footprint and core pin layout
• Very low power consumption with separate baseband and PA power supply inputs for extended operational life in battery powered devices
• Integrated support for AirVantage management services, including ready-to-use lifetime firmware upgrades

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MC7455

• 4G/3G multimode module with miniPCIe form factor
• Optimized for IoT and eMBB applications
• Embedded TCP/IP stack to easily communicate over the internet
• LTE carrier aggregations
• GNSS receiver enables tracking and location-based services

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MC7710

• Compact, lightweight, wireless LTE- and UMTS-based modem
• Ideal for portable and handheld computers, point-of-sale devices, telemetry products and other M2M applications

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Q2687

• Self-contained E-GSM/DCS/GSM850/PCS/GPRS/EGPRS 900/1800/850/1900 Quad band embedded module
• Supports Open AT Application Framework for embedded standard ANSI C applications to natively execute

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RC7620

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• VoLTE supported
• GNSS receiver enables tracking and location-based services

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RC7620-1

• LTE Cat.4 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+, and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• VoLTE supported
• GNSS receiver enables tracking and location-based services

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WP7607

• LTE Cat.4/3G/2G module with compact CF3® design to migrate between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Industrial grade tested in harsh environments and exterme temperatures
• Voice call and SMS (Text/PDU format) support

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WP7607-1

• LTE Cat.1/3G/2G module with compact CF3® design to migrate between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Industrial grade tested in harsh environments and exterme temperatures
• Voice call and SMS (Text/PDU format) support

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WP7702

• Implements Sierra Wireless CF3® form factor to allow migrating between technologies and future-proof product designs
• Dedicated ARM core application processor running Legato® open source software
• mangOH® reference designs enable rapid prototyping and proof of concepts
• Worldwide coverage on a single module with industry and mobile network certifications
• Ultra-Low Power Mode - Reduce power consumption by 200x for battery or solar powered applications
• Integrated GNSS receiver enables tracking and location-based services (optional)
• Tested for harsh environments and extreme temperatures (-40°C / +85°C)

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SIMCom

A7602E

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O Voltage
• VoLTE support
• Form factor is compatible with the SIM7600/SIM7600-H Series
• GNSS receiver enables tracking and location-based services (-FASE version)

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A7672E

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O Voltage
• VoLTE support
• Form factor is compatible with the SIM7000/SIM7070 Series
• GNSS receiver enables tracking and location-based services

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A7672E MiniPCIe

• LTE Cat.1 bis module with MiniPCIe form factor
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• VoLTE support
• Form factor is compatible with the SIM7000/SIM7070 Series
• GNSS receiver enables tracking and location-based services

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A7682E

• LTE Cat.1bis module optimized for M2M and IoT applications
• Worldwide LTE and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• VoLTE support
• GNSS receiver enables tracking and location-based services

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SIM800C

• Low cost device Extremely compact design at 17.6mm x 15.7mm x 2.3mm
• Extended temperature range of -40°C to +85°C
• Voice call and SMS support 43 pad SMT package

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SIM868

• Low power consumption
• Low cost device
• Extended temperature range of -40ºC to +85ºC
• Quad-band 850, 900, 1800, 1900 MHz
• Compact design with LCC / LGA pads
• GNSS support
• Voice call and SMS (Text/PDU format) support

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SIM868E

• Low power consumption
• Low cost device
• Extended temperature range of -40°C to +85ºC
• Quad-band 850, 900, 1800, 1900 MHz
• Compact design with LCC / LGA pads
• GNSS support
• Voice call and SMS (Text/PDU format) support

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SIM7000E

• Multi-Technology Integrated: NB-IoT / Cat.M1 / EGPRS for EMEA / Australia
• Integrated GNSS (GPS, GLONASS, Galileo, BeiDou)
• LCC Package and AT commands mostly compatible with SIM900 and SIM800F 
• Embedded TCP(TLS) / UDP(DLS) / IPv4 / IPv6 stack
• Enhanced features: HTTP(s) / FTP / MQTT / EMAIL / LBS / NTP / DNS / PIN / CoAP / LwM2M / SMS / DFOTA / VoLTE / FileSystem / ALI_IOT
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

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SIM7000G

• Multi-Technology Integrated: NB-IoT / Cat.M1 / EGPRS for global market
• Integrated GNSS (GPS, GLONASS, Galileo, BeiDou)
• LCC Package and AT commands mostly compatible with SIM900 and SIM800F with Embedded TCP(TLS) / UDP(DLS) / IPv4 / IPv6 stack
• Enhanced features: HTTP(s) / FTP / MQTT / EMAIL / LBS / NTP / DNS / PING / CoAP / LwM2M / lSMS / DFOTA / VoLTE / FileSystem / ALI_IOT
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

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SIM7020E

• Multi band NB-IoT for EMEA market
• Compliant with 3GPP^TM Rel.13, SW updating to support Rel.14 in future
• Compact size: 17.6mm x 15.7mm x 2.3 mm
• LCC Package and AT commands mostly compatible with SIM800C (2G) to maximize the investments of customers by enabling a short time-to-market 
• Embedded TCP / UDP / IPv4 / IPv6 stack
• Enhanced features: SMS / HTTP(s) / PPP / NTP / DNS / PING / DFOTA / MQTT / CoAP / LwM2M / TLS(DTLS)
• Minimum power consumption and extended coverage / PSM & eDRX
• Extended temperature range: -40°C to +85°C

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SIM7020G

• With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the SIM7020G can extend battery life up to 10 years
• SIM7020G provides deeper coverage enhancement compared to GSM
• Both package and AT commands of SIM7020G are mostly compatible with SIM800C

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SIM7022

• Multi-Band NB-IoT module solution in a SMT type
• With Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), it can extend battery life to 10 years
• Provides deeper coverage enhancement compared to GSM
• The package and AT commands are mostly compatible with SIM800C and SIM7020
• Strong extension capability with rich interfaces including UART, GPIO, etc., providing much flexibility and ease of integration for customer applications

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SIM7070G

• Supports wireless communication modes of Cat-M/Cat-NB/GPRS/EDGE
• Adopts LCC form factor and has a compact size of 24 mm x 24 mm which makes it ideal for compact products design
• Powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions
• Ideally suited for M2M applications, such as metering, asset tracking, remote monitoring, e-health, etc.
• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), the SIM7070 series can extend battery life up to 10 years
• Provides deeper coverage enhancement compared to GSM
• The form factor and AT commands of the SIM7070 series are compatible with SIM7000X/SIM800F/SIM900

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SIM7080G

• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), SIM7080G can extend battery life to 10 years
• LTE-M, NB-IoT dual mode
• The package of SIM7080G is compatible with SIM868
• Strong extension capability with rich interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• The module provides much flexibility and ease of integration for customer's application
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions

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SIM7090G

• With Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX), battery life can be extended up to 10 years
• Provides deeper coverage enhancement compared to GSM
• Ultra-compact size for wearable tracker application
• Adopts LGA form factor and has a compact size of 14.8 mm x 12.8 mm which makes it ideal for compact products design
• Powerful expansibility with abundant interfaces including UART, GPIO, PCM, SPI, I²C, etc.
• Designed for applications that need low latency, low throughput data communication in a variety of radio propagation conditions

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SIM7500E

• Multimode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• GNSS supported (GPS, GLONASS) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Compact LGA type design (24mm x 27mm x 2.75 mm)
• Voice call and SMS (Text/PDU format) support

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SIM7500E-PCIE

• Mini-PCIE interface with strong compatibility
• Suitable for LTE, UMTS, and GSM networks with global coverage
• Abundant software functions: FOTA, LBS, TLS, VoLTE
• Multi-constellation GNSS receiver support
• AT commands of the SIM7500-PCIE series are compatible with the SIM7600/SIM7600-H series modules

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SIM7500E-PCIEA

• Mini-PCIE interface with strong compatibility
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, LBS, TLS, VoLTE
• Multi-constellation GNSS receiver support
• AT commands of the SIM7500-PCIE series are compatible with the SIM7600/SIM7600-H series modules
• Analog audio coded integrated directly on the PCB

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SIM7600E

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• GNSS supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Compact LCC type design (30.0mm x 30.0mm x 2.9 mm) - unified form factor compatible with family of modules

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SIM7600E-PCIE

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• Optional GNSS interface supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Mini-PCIE interface with strong compatibility

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SIM7600E-PCIEA

• Multi mode capability including low latency LTE Cat.1 connectivity
• Lowest cost LTE category module
• Low power consumption with extended idle and sleep mode (<5mA @sleep)
• IPv4v6 / IPv6 support
• Optional GNSS interface supported (GPS, GLONASS, Beidou) – standalone/assisted
• Extended temperature range of -40°C to +85°C
• Mini-PCIE interface with strong compatibility
• In-built support for coded analog audio

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SIM7600E-H

• Multi mode capability including high speed connectivity thanks to LTE Cat.4
• IPv6 support
• VoLTE support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Compact design (30mm x 30mm x 2.9 mm)
• Two variants available – miniPCIe and LCC
• Voice call and SMS (Text/PDU format) support

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SIM7600E-H-PCIE

• Multi mode capability including high speed connectivity thanks to LTE Cat.4
• IPv6 support
• Firmware over the air (FOTA) updates
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• VoLTE support
• Voice call and SMS (Text/PDU format) support
• Compact design (30mm x 30mm x 2.9mm)

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SIM7600G

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, TLS, VoLTE
• Multi-constellation GNSS receiver support
• Extreme operating temperature range -40°C to +85°C

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SIM7600G-H

• LCC+LGA form factor with abundant interfaces
• Suitable for LTE, UMTS and GSM networks with global coverage
• Abundant software functions: FOTA, TLS, VoLTE
• Optional: Multi-constellation GNSS receiver support
• Extreme operating temperature range -40°C to +85 °C

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SIM7906E-M2

• Multi mode capability including low latency LTE Cat.6 connectivity
• Operating temperature range of -30°C to +70°C
• M.2 interface with high compatibility
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support
• Industry standard design (42mm x 30mm x 2.3mm)
• Suitable for LTE, HSPA+ networks with global connectivity

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SIM7906E-PCIE

• Multimode capability including low latency LTE Cat.6 connectivity
• Operating temperature range of -30°C to +70°C
• M.2 interface with high compatibility
• Abundant software functions: FOTA, SSL, TLS
• Multi-constellation GNSS receiver support
• Industry standard design (42mm x 30mm x 2.3mm)
• Suitable for LTE, HSPA+ networks with global connectivity

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SIM8200G

• Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which adopts LGA form factor
• Supports Rel.15 5G NSA/SA up to 2.4Gbps data transfer
• Strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc.
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Due to the unique combination of performance, security and flexibility, this module is suited for many applications

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SIM8202E-M2

• 5G/4G/3G multi-mode module with M.2 form factor, optimized for IoT and eMBB applications
• Both NSA and SA modes supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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SIM8202G-M2

• Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which adopts M.2 form factor
• Supports Rel.15 5G NSA/SA up to 2.4Gbps data transfer
• Strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc.
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Due to the unique combination of performance, security and flexibility, this module is suited for many applications

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Skyworks

SKY66430

• Multi-band multi-chip System-in-Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms
• Integrates the entire RF front end, transceiver, power management, memory, and baseband modem
• LTE multi-band radio operating in the 698 to 2200 MHz frequency range
• NOR flash, crystals, and a few passives external to the package complete the SiP implementation

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Telit

FN980

• Support of 5G sub-6 FDD and TDD for global deployment
• Support of SA and NSA operations for full network compatibility
• 5G Rel. 15, 4G Cat 20 up to 7 CA, 3G HSPA+ Rel. 8 for fallback to legacy networks
• Intraband and interband UL CA supported on 4G networks for better throughput performance for Uplink-centric applications, like surveillance cameras and 4K/8K video streaming
• State-of-the-art GNSS receiver with double frequency GPS (Band L1/L5) for better accuracy

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GE310-GNSS

• Automated manufacturing process with friendly, miniature, and futureproof footprint
• BT 4.0 Transceiver
• GPS, GLONASS, Galileo and Beidou navigation
• Ideal solution for applications such as asset management, utilities, and telematics
• Battery friendly operation with 2.8V GPIOs

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GE866-QUAD

• Easy and low cost to integrate in small application sizes because of ultra-compact and robust LGA package
• Easy to use in mass-production automated manufacturing

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GE910-GNSS

• 4 GSM/GPRS bands support
• Unified xE910 family form factor
• Python script interpreter
• GNSS supported
• Extended temperature range
• 2MB memory for application, 2MB RAM Voice call and SMS support
• Compact design (28.20mm × 28.20mm × 2.25mm)

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GE910-QUAD

• Design once and deploy globally, thanks to xE910 unified form factor
• Perfect platform for medium-to-high-volume IoT applications

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GE910-QUAD AUTO

• 4 GSM/GPRS bands support
• ARM 11 processor and onboard memory to run applicatioin in the module
• Unified xE910 family form factor
• Python script interpreter Idela for 2G applications for OEM and aftermarket automotive
• Voice capable for applications requiring either analog or digital
• Extended temperature range eCall compliant
• Voice call and SMS support
• Compact design (28.20mm × 28.20mm × 2.25mm)

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GE910-QUAD V3

• Cost-optimized, long-term available 2G variant
• Two ITU-T V.24 UART interfaces, ten 1.8 V I/O ports

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GL865-DUAL V3

• Automated manufacturing process friendly product in its small compact LCC/VQFN packaging
• Battery friendly operation with 1.8V GPIOs
• Easy to bandle with external GPS | GLONASS receivers
• Over-the-Air firmware update by means of Premium FOTA Management
• Complete SMT platform for M2M solutions with embedded Python Script Interpreter
• Jamming detection
• Ideal for security alarms, automated meter reading, and POS terminals; (with external GPS) fleet management, tracking

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GL865-DUAL V3.1

• 2 GSM/GPRS bands support
• Full HW and SW compatibility with previous V3 generation – direct replacement path
• Pin-to-pin compatibility with 3G variant – UL865
• Recommended for new 2G cost-sensitive designs
• Recommended for applications requiring ultra low power consumption
• Ideal for applications in security alarm systems, automated meter readings and POS terminals GNSS supported – external module needed
• Python script interpreter
• 800 kB memory for application, 1 MB RAM
• Voice call and SMS support
• Compact design (24.4mm × 24.4mm × 2.6mm)

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GL865-QUAD V3

• Automated manufacturing process friendly product in its small footprint
• Battery friendly operation with 1.8 V GPIOs
• Easy to bandle with external GPS | GLONASS receivers
• Over-the-Air firmware update by means of Premium FOTA Management
• Complete SMT platform for M2M solutions with embedded Python Script Interpreter
• Jamming detection
• Ideal for security alarms, automated meter reading, and POS terminals; (with external GPS) fleet management, tracking

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GL865-QUAD V3.1

• 4 GSM/GPRS bands support
• Full HW and SW compatibility with previous V3 generation – direct replacement path
• Pin-to-pin compatibility with 3G variant – UL865
• Recommended for new 2G cost-sensitive designs
• Recommended for applications requiring ultra low power consumption
• Ideal for applications in security alarm systems, automated meter readings and POS terminals GNSS supported – external module needed
• Python script interpreter
• 800 kB memory for application, 1 MB RAM Voice call and SMS support
• Compact design (24.4mm × 24.4mm × 2.6mm)

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HE910-EUR

• Design once and deploy globally, thanks to xE910 unified form factor
• Perfect platform for a wide range of applications requiring HSPA connectivity
• LGA package ideal for low profile integrated solutions, reducing cost and saving space and weight in portable devices
• Built-in UDP/IP and TCP/IP stacks
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Suited for a wide range of industrial and consumer applications with high data throughput requirements, including asset & fleet tracking, telematics, PDAs, security surveillance, personal navigation devices, e-readers and consumer electronics

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LE910-EU1

• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, SMTP, FTP, SSL
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

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LE910-EU V2

• Easy to integrate with peripherals and actuators using USB 2.0
• HS, UART and user definable GPIOs Increased connectivity performance with MIMO 2x2
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, SMTP, FTP, SSL
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Bundle options with Telit GNSS solutions

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LE910C1-EU

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C1-EU mPCIe

• Standard Mini PCIe Data-card form factor
• LTE Cat.1 support, best-in class 3GPP^TM Rel.10 platform
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART, and user definable GPIOs
• Battery-friendly 1.8V GPIO
• Ideal platform for IoT applications, mobile data, and computing devices, with ultra-compact design and extended operating temperature range
• Internet-friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design re-use path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

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LE910C1-EUX

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C1-WWX

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C1-WWXD

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C4-EU

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C4-EU mPCIe

• Standard Mini PCIe Data-card form factor
• LTE Cat.4 support, best-in class 3GPP^TM Rel.10 platform
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART, and user definable GPIOs
• Battery-friendly 1.8V GPIO
• Ideal platform for IoT applications, mobile data, and computing devices, with ultra-compact design and extended operating temperature range
• Internet-friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design re-use path to 2G and 3G with any xE910 module
• Over-the-Air firmware update

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LE910C4-WWX

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910C4-WWXD

• MTC features ready according to 3GPP^TM Rel.12
• Easy to integrate with peripherals and actuators using USB 2.0 HS, UART and user definable GPIOs
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Simple drop-in migration and technology design reuse path to 2G and 3G with any xE910 module
• Over-the-Air firmware update
• Embedded GNSS solution

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LE910R1-EU

• 2G/LTE Cat.1 bis module optimized for M2M and IoT applications
• Ideal for medium and low-rate communication solutions
• Internet friendly with integrated TCP/IP and UDP/IP stacks
• Suitable for IoT applications that need a smooth migration from sunsetting 2G and 3G networks
• Support for frequency bands of major operators in Europe

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LE910S1-EA

• New member of Telit’s flagship xE910 module family
• 2G/LTE Cat.1 3GPP^TM Release 9-compliant, single antenna module
• Uplink up to 5 Mbps, Downlink up to 10Mbps
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, HTTPS, NTP, FTP, PPP
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range

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LE910S1-EAG

• New member of Telit’s flagship xE910 module family
• 2G/LTE Cat.1 3GPP^TM Release 9-compliant single antenna module
• Uplink up to 5 Mbps, Downlink up to 10Mbps
• Internet friendly with integrated TCP/IP and UDP/IP stacks, as well as HTTP, HTTPS, NTP, FTP, PPP
• Ideal platform for IoT applications and devices with ultra-compact design and extended operating temperature range
• Embedded GNSS receiver makes it ideal for all-in-one tracking use cases

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LM960A18

• Standard mPCIe data card form factor
• LTE Cat.18: Exceptional high speed with data rates of up to 1.2 Gbps download and 150 Mbps upload
• Support for Uplink 2xCA and up to 5xCA on Downlink with 4x4 MIMO, 256QAM
• Ample LTE frequency band support
• 3G fallback technology
• Wide range of operating temperatures

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ME310G1-W1

• Small size and low power consumption
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT devices
• An ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other global mass-production, mass-deployment applications
• Module sizes ranging from 300 mm² to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME310G1-WW

• Small size and low power consumption
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT devices
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• An ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other global mass-production, mass-deployment applications
• Module sizes ranging from 300 mm² to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910C1-E1

• Industry popular xE910 form factor futureproofed to 5G 
• Tri-band Mobile IoT (Cat.NB1 & M1) support for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910C1-E2

• Industry popular xE910 form factor futureproofed to 5G 
• Tri-band Mobile IoT (Cat.NB1/M1) support with 2G fallback for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910C1-WW

• Design once and deploy globally with the swappable xE910 form factor family
• Perfect platform for IoT applications such as smart metering, security & surveillance, point of sale, health monitoring, fleet management, asset tracking and wearable devices
• Worldwide Single-SKU with multi-band support: B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B26, B28
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910C1-WW mPCIe

• Standard mini PCIe data card form factor
• Perfect platform for IoT applications such as smart metering, security & surveillance, point of sale, health monitoring, fleet management, asset tracking and wearable devices
• Worldwide Single-SKU with multi-band support: B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B26, B28
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910G1-W1

• Design once and deploy globally with the xE910 28.2 x 28.2 x 2.2 mm form factor family
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910G1-WW

• Design once and deploy globally with the xE910 28.2 x 28.2 x 2.2 mm form factor family
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ME910G1-WW mPCIe

• Standard mini PCIe data card form factor
• An ideal solution for global IoT applications such as smart metering, security and surveillance, point of sales, health monitoring, fleet management, and asset tracking
• Compliant to 3GPP^TM Rel.14 Cat.M1/NB2, tailored for IoT
• 2G fallback ensures the best service in regions with mixed LTE-M/NB-IoT and 2G network coverage
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ML865C1-EA

• Design once and deploy globally, thanks to the xL865 form factor family
• Compact VQFN package
• Perfect platform for regional IoT applications
• 3GPP^TM Release 13 LTE UE Category M1/NB1-compliant
• Support for Telit OneEdge innovative module-embedded software system with pre-packaged, secure, easy-to-use deployment and management tools

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ML865G1-WW

• Design once and deploy globally with the xL865 form factor family
• LTE UE Cat-M1/NB2, compliant to the latest 3GPP^TM Rel.14 enhanced machine-type communication (MTC), with 2G fallback
• Optimized for low power consumption and wide area coverage
• Compact VQFN package is ideally suited for low profile integrated solutions, limited real estate application boards, reducing costs in high-volume applications and saving space and weight in portable devices
• The perfect platform for IoT applications, such as smart metering, health monitoring, fleet management and asset tracking

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NE310H2-W1

• Small size and low power consumption
• Optimized for ease-of-design, high yield and low-cost manufacturing
• Compliant to 3GPP^TM Release 14 Cat NB2, tailored for IoT devices
• Ideal solution for medical devices, fitness trackers, industrial sensors, smart meters, and other mass-production, mass-deployment applications
• Module sizes ranging from 300 down to below 200 mm² on a fixed 94-pad LGA footprint enable a “design once, use anywhere” IoT device strategy

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NE310L2-W1

• Small form factor ideal for size-constrained applications
• Ultra-low power consumption
• 3GPP^TM Rel.14 Cat-NB2 evolution in the new Telit form factor xE310
• Perfect platform for global IoT applications such as smart metering, smart agriculture, health monitoring and asset tracking

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NE310L2-WW

• Small form factor ideal for size-constrained applications
• Ultra-low power consumption 3GPP^TM Rel.14 Cat-NB2 evolution in the new Telit form factor xE310
• Perfect platform for global IoT applications such as smart metering, smart agriculture, health monitoring and asset tracking
• 2G fallback to guarantee coverage also in those areas where NB-IoT is not yet available

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NE866B1-E1

• Design once and deploy globally, thans to xE866 form factor family
• Very small LGA package ideally suited for low profile integrated solutions, limited real estate application boards
• Perfect platform for regional IoT applications such as smart metering, security & surveillance, POS, health monitoring, fleet management, asset tracking and wearables
• LTE UE Category NB1 compliant to latest 3GPP Rel.13 enhanced Machine-Type-Communications (eMTC), specifically designed for IoT use cases
• Minimum power consumption and extended coverage
• Embedded UDP/IP stack
• Extended temperature range: -40°C to +85°C

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NE910C1-E1

• Industry popular xE910 form factor futureproofed to 5G 
• Cost-optimized dual-band Cat.NB1 support for pan-European deployment
• Telit AppZone C runs customer applications directly in the module
• Superior Telit Engineering power-saving and RF performance
• Optional embedded full-featured GNSS functionality

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NL865H2-W1

• Compliant to 3GPP^TM Release 14 Cat.NB2, tailored for IoT devices
• Ideal solution for smart meters, industrial sensors, medical devices, asset tracking and wearable devices
• Multiple bands supported for worldwide deployment
• Design once and deploy globally, thanks to the xL865 form factor family

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UE866-EU

• Smallest module in Telit’s 3G portfolio
• Design once and deploy globally, with the xE866 pinto-pin compatible form factor family
• Compact LGA package is ideally for low profile integrated solutions with space constraints, reducing costs and weight
• Over the air firmware update
• Built-in UDP/TCP/FTP/SMTP stack, IP stack with TCP and UDP protocol
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Ideal solution for applications in wearables, telematics, UBI applications, fleet management and asset tracking

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UE910-EUR

• Design once and deploy globally, thanks to xE910 unified form factor
• Voice-capable for Applications requiring digital (DVI) interface
• LGA package ideal for low profile integrated solutions, reducing cost and saving space and weight in portable devices
• Built-in UDP/IP and TCP/IP stacks
• Supports IoT LOCATE, a Telit portal-based service providing device’s position based on observed cellular Cell-IDs
• Perfect platform for regional applications such as vending systems, POS, smart grid, security and surveillance
• Ideal solution for Applications in wearables, telematics, UBI applications, fleet management and asset tracking

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UL865-EUR

• Simple drop-in migration and technology upgrade path to 3G high-speed performance for designs using GL865-DUAL V3
• Voice-capable for Applications requiring digital (DVI) interface
• Battery-friendly 1.8 V GPIO
• Over the air firmware update (Premium FOTA management)
• Built-in UDP/IP and TCP/IP stacks
• Complete SMT platform for IoT solutions running customer application inside module with embedded Python script interpreter
• Designed for use in POS terminals, Health monitoring, security alarms with cameras, handheld scanners, logistics devices and battery powered devices
• Ideal solution for fleet management and asset tracking when pairing with external GPS|GLONASS receivers

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Teltonika Networks

TNB 260

• Ultra small size (14.2mm x 14.2mm) for easy manufacturing
• Ultra low power consumption: <4.1µA in Deep Sleep Mode
• Extended temperature range of -40ºC to +85ºC
• NIDD support (Non-IP Data Delivery)
• Made in Lithuania

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Thales

Cinterion® ALS3-E

• Wide high speed connectivity capability (LTE Cat.3)
• IPv6 support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Compact design (29mm x 33mm x 2.3mm)

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Cinterion® BGS2-E

• Low-cost device
• Extended temperature range of -40°C to +90°C
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.99 support
• Low power consumption

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Cinterion® BGS2-W

• Low-cost device
• Low power comsumption
• Quad band 850, 900, 1800, 1900 MHz
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel.99
• Extended temperature range of -40°C to +90°C

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Cinterion® BGS5

• Low-cost device
• Low power consumption
• Quad band 850, 900, 1800, 1900 MHz
• Compact design (27.6mm x 18.8mm x 2.7mm)
• Voice call and SMS (Text/PDU format) support
• 3GPP^TM Rel. 6
• Extended temperature range of -40°C to +85°C

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Cinterion® BGS12

• Ideal for long life solutions such as metering, tracking and tracing and remote maintenance and control
• Quad-Band GSM (850, 900, 1800, 1900MHz) and GPRS class 12 for global connectivity
• Optimized power supply design and advanced power management system extends battery life and improves Total Cost of Ownership (TCO)
• An embedded IP stack with IPv4 support provides Internet service that is protected by an advanced security concept including TLS/DTLS support and jamming detection
• A dual SIM with smart switching technology securely manages the connection to cellular networks and encrypts data
• Customer manufacturing support services simplify the device test method (RF TX Wave Generation / RX Power Measurement) and provide a simplified set-up for customer manufacturing processes

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Cinterion® EES3

• Full-featured, truly industrial and scalable platform with leading-edge LGA technology
• Powerful processor large memory
• Quad band
• GPRS/EDGE class 12

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Cinterion® EHS5-E

• Dual band UMTS and GSM
• Operating Temperature: -40°C to +90°C
• 3GPP^TM Rel.7 compliant
• JAVA embedded

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Cinterion® EHS6-A

• UMTS Penta band support
• GSM Quad band support
• Operating Temperature: -40°C to +90°C
• 3GPP^TM Rel.7 compliant
• JAVA embedded
• Integrated FOTA
• RLS monitoring

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Cinterion® ELS61-E R2

• LTE Cat.1
• Incremental firmware update over-the-air
• IPv6 support
• Extended temperature range of -40°C to +85°C
• SMS (Text/PDU format) support
• Compact design (27.6mm x 25.4mm x 2.2mm)

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Cinterion® ELS62-E

• 2G/LTE Cat.1bis 3GPP Release 13 compliant single antenna module with RPM support
• Regional LTE coverage in EMEA, with VoLTE and 2G fallback
• Uplink up to 5.2 Mbps, Downlink up to 10.2 Mbps
• Easy Connectivity (eSIM support) and Lifecycle Management (FOTA)
• Easy migration from Cinterion® 2G/3G/LTE Cat.1 modules

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Cinterion® ELS62-W

• 2G/LTE Cat.1bis 3GPP Release 13 compliant single antenna module with RPM support
• Regional LTE coverage in EMEA/LATAM/India, with VoLTE and 2G fallback
• Uplink up to 5.2 Mbps, Downlink up to 10.2 Mbps
• Easy Connectivity (eSIM support) and Lifecycle Management (FOTA)
• Easy migration from Cinterion® 2G/3G/LTE Cat.1 modules

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Cinterion® ELS81-E

• LTE Cat.4 Connectivity with 2G/3G Fallback
• LTE (FDD) 3GPP^TM Rel.9 compliant protocol stack, with DL-MIMO/RX-Diversity
• Secure connection with TLS
• TCP/IP stack access via AT command and transparent TCP/UDP services
• Incremental firmware update over-the-air
• Java^TM embedded

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Cinterion® ENS22-E

• Penta band NB-IoT (3, 5, 8, 20, 28) connectivity with deep indoor coverage and extended range
• Multi-design capability (LGA) compatible with Gemalto’s comprehensive suite of solutions, services and platforms that help enterprises Connect, Secure and Monetize^TM IoT technology
• Advanced power management system extends battery lifetime and improves TCO
• Embedded IP stack supports a range of internet services protected by an enhanced security concept
• Incremental Firmware Over The Air (FOTA) updates for saving power, bandwidth and battery life
• Optional embedded secure element for an added layer of security for extra-sensitive applications
• Optional integrated eSIM and Bearer Independent Protocol support

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Cinterion® EXS62-W

• Multimode support: LTE-M, NB-IoT
• eSIM – Remote provisioning
• Advanced power management system
• Embedded IP stack
• Incremental FOTA updates
• Embedded processing
• State of the art security
• Multi design capability (LGA)
• Secure cloud enrollment

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Cinterion® mPLS62-W

• IoT-optimized power management
• LTE Cat.1 module optimized for M2M and IoT applications
• Complete and seamless global IoT connectivity
• Cell-ID based location
• Supports extended temperature range of -40°C to +90°C
• Very easy to integrate by simply plugging into an existing 52-pin express card slot

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Cinterion® mPLS8-E

• IoT-optimized power management
• LTE Cat.3 module optimized for M2M and IoT applications
• Complete and seamless global IoT connectivity
• Integrated GPS/GLONASS/GALILEO solution
• Extended temperature range of -40°C to +90°C
• Very easy to integrate by simply plugging into an existing 52-pin express card slot

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Cinterion® MV31-W

• 3G/LTE/5G Cat.20 module based on the Qualcomm SDX55 chipset
• Both 5G modes: NSA and SA are supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4 / 2x2), EN-DC/LTE carrier aggregations
• Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
• Backwards compatible module, to help facilitate the migration and differentiation between 4G LTE and 5G

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Cinterion® PHS8-P

• The thinnest 3G LGA module in the market
• Penta band 3G
• Quad band 2G
• HSDPA Cat.10 / HSUPA Cat.6 data rates
• Standalone GPS/GLONASS and A-GPS support

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Cinterion® PLS8-E

• Wide high speed connectivity capability (LTE Cat.3)
• IPv6 support
• GNSS supported (GPS, GLONASS)
• Extended temperature range of -40°C to +85°C
• Voice call and SMS (Text/PDU format) support
• Compact design (29mm x 33mm x 2.2mm)

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Cinterion® PLS62-W

• Twelve worldwide LTE bands (LTE Cat. 1)
• Free firmware updates over the air (FOTA)
• IPv6 support
• Extended temperature range of -40°C to +90°C
• SMS (Text/PDU format) support
• Compact design (33mm x 29mm x 2.3 mm)

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Cinterion® PLS63-EP

• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the internet
• Flexible I/O Voltage
• GNSS receiver enables tracking and location-based services

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Cinterion® PLS63-W

• LTE Cat.1 module optimized for M2M and IoT applications
• Worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Embedded TCP/IP stack to easily communicate over the Internet
• Flexible I/O voltage
• GNSS receiver enables tracking and location-based services

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Cinterion® TX62-W

• Multiple MTC technologies for global connectivity - 3GPP^TM Rel.14 Cat.M1, Cat.NB1, and Cat.NB2
• Breakthrough Things footprint - Compact form factor developed for the needs of small, battery-operated devices, with large surface pads for improved soldering and reduced SMT warpage
• Ultra-integrated for lower Total Cost of Ownership - Application processor and embedded GNSS with multi constellation
• State-of-the-art and secure - Pre-provisioned digital identities in the roof of device, embedded eSIM option, and secure key store
• Easy connectivity and lifecycle management - Remote update and device management, secure enrollment into main cloud platforms including AWS IoT Core or Azure IoT Hub

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Cinterion® TX82-W

• Multiple MTC technologies for global connectivity - 3GPP^TM Rel.14 Cat.M1, Cat.NB1, Cat.NB2, and 2G
• Breakthrough Things footprint - Compact form factor developed for the needs of small, battery-operated devices, with large surface pads for improved soldering and reduced SMT warpage
• Ultra-integrated for lower Total Cost of Ownership - Application processor and embedded GNSS with multi constellation
• State-of-the-art and secure - Pre-provisioned digital identities in the roof of device, embedded eSIM option, and secure key store
• Easy connectivity and lifecycle management - Remote update and device management, secure enrollment into main cloud platforms including AWS IoT Core or Azure IoT Hub

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Thundercomm

TurboX T62G-EA

• 5G/4G multi-mode module with LGA form factor, optimized for IoT and eMBB applications
• Both 5G modes: NSA and SA are supported
• Supports a wide range of supported LTE/5G NR frequency bands commonly used in many different regions of the world
• Downlink/Uplink MIMO (4x4/2x2), ENDC/LTE carrier aggregations
• OpenCPU with comprehensive SDK
• High speed interface drivers for multi OS

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u-blox

LARA-R211

• LTE Cat.1 modules with 2G or 3G fallback
• Voice support via VoLTE or CSFB Cellular location service and hybrid positioning
• Small, compact LARA LGA form factor for easy manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules

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MPCI-L210

• Powerful LTE modules in industry‑standard Mini PCIe package
• Highest throughput of up to 150 Mb/s with LTE Cat.4
• Easy migration between u-blox 2G, 3G, and 4G modules
• 6 LTE bands Deliver critical firmware updates over the air
• Manufactured in ISO/TS 16949 certified production sites
• Extreme operating temperature range -40°C to +85°C

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SARA-G350

• Automotive-grade and ATEX-certified options
• Very small SARA LGA form factor for easy manufacturing
• Industry-leading, low power consumption (<0.90 mA standby)
• Separate power supply extends battery life
• Easy migration between u‑blox 2G, 3G, and 4G modules
• Supports eCall and ERA-GLONASS, CellLocate® indoor positioning, and GNSS / A-GNSS integration

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SARA-G450

• Industry proven SARA form factor
• Easy migration between u-blox 2G, 3G, LPWA (LTE-M and NB-IoT), LTE Cat.4 and LTE Cat.6 modules
• Simple integration with embedded Internet suite
• Optimized power consumption for IoT applications

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SARA-N200

• Ultra-low power consumption delivering 10+ years battery life, with excellent extended range in buildings underground (MCL 164 dB)
• Extended temperature range of -40°C to +85ºC and ISO/TS16949 manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

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SARA-N210

• Ultra-low power consumption delivering 10+ years battery life
• Excellent extended range in buildings, underground (MCL 164dB)
• Extended temperature range of -40°C to +85°C and ISO/TS16949 manufacturing
• Easy migration between u blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

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SARA-N211

• Ultra-low power consumption delivering 10+ years battery life
• Excellent extended range in buildings, underground (MCL 164dB)
• Extended temperature range of -40°C to +85°C and ISO/TS16949 manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• Very small SARA LGA form factor for easy manufacturing
• Support for both IP based and Non-IP based Small Data over NAS (SDoNAS)

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SARA-N310

• Broad feature set enabling new IoT applications
• Ultra-low power consumption delivering 10+ years battery life
• Critical firmware updates delivered via uFOTA with LwM2M
• Easy migration between u-blox LTE-M and 2G modules
• Professional grade manufacturing (ISO/TS16949); qualified according to ISO 16750

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SARA-N410-02B

• Ultra-compact LTE Cat.NB1 module with multi-regional coverage
• Configurable with a single hardware version
• Deliver critical firmware updates via uFOTA with LwM2M
• Low power consumption and longer battery life
• Extended range in buildings, basements and underground
• Easy migration between u-blox 2G, 3G, and 4G modules

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SARA-R410M-02B

• Global configurability with single hardware version
• LTE Cat M1/Cat NB1 multimode module with ultra-low power consumption
• Deliver critical firmware updates via uFOTA with LWM2M
• Easy migration between u-blox 2G, 3G and 4G modules

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SARA-R412M-02B

• LTE Cat M1/Cat NB1/ EGPRS multimode module with ultra-low power consumption
• Global configurability with single hardware version
• Delivers critical firmware updates via uFOTA with LWM2M
• Easy migration between u-blox 2G, 3G and 4G modules

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SARA-R422

• Always and everywhere location, integrated u-blox M8 GNSS receiver and CellLocate®
• Software-based configurability within each hardware design
• Simultaneous LTE communication with GNSS positioning
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LwM2M and uFOTA

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SARA-R422M8S

• Always and everywhere location, integrated u-blox M8 GNSS receiver and CellLocate®
• Software-based configurability within each hardware design
• Simultaneous LTE communication with GNSS positioning
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LWM2M and uFOTA

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SARA-R422S

• Always and everywhere location, integrated u-blox CellLocate®
• Software-based configurability within each hardware design
• Guaranteed best coverage with 23dBm output power
• Future-proof solutions via LwM2M and uFOTA

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SARA-U201

• UMTS/HSPA efficient and cost-effective module provide efficient high-speed mobile connectivity in an ultra-small LGA form factor
• Supports eCall, ERA‑GLONASS, CellLocate® indoor positioning, and GNSS / A‑GNSS integration
• Extended temperature range –40°C to +85°C and ISO/TS16949 manufacturing
• Automotive-grade and ATEX-certified options available
• Low power consumption and a rich feature set including dual-stack IPv4 / IPv6

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SARA-U270

• UMTS/HSPA efficient and cost-effective module provide efficient high-speed mobile connectivity in an ultra-small LGA form factor
• Supports eCall, ERA‑GLONASS, CellLocate® indoor positioning, and GNSS / A‑GNSS integration
• Extended temperature range –40°C to +85°C and ISO/TS16949 manufacturing
• Automotive-grade and ATEX-certified options available
• Low power consumption and a rich feature set including dual-stack IPv4 / IPv6

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TOBY-L210

• Automotive grade available, qualified according to ISO 16750
• Compact TOBY LGA form factor for easy manufacturing
• Easy migration between u-blox 2G, 3G, and 4G modules
• 6 LTE bands Deliver critical firmware updates over the air
• Simple integration with the ELLA-W131 Wi-Fi module
• Extreme operating temperature range -40°C to +85°C

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USR IOT

WH-NB71

• Super small encapsulation size: 17.5mm x 15mm
• SMT surface-mount technology package
• Extended temperature range: -30°C to +85°C at full performance, down to -40°C at reduced performance

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Würth Elektronik

Adrastea-I

• Compact LTE-M/NB-IoT Cellular module design allows for implementation in small-size applications
• Provides AT-Command-based multi-band configurability, enabling international multi-regional coverage in LTE Cat.M1 / NB1 radio access technologies
• Includes a fully integrated global navigation satellite system solution that supports GPS and GLONASS positioning systems
• The ARM Cortex-M4 processor is exclusively for user application software, and it offers 1 MB of flash and 256 kB of RAM dedicated to this use

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Gesicherte Interoperabilität aller neuen Technologien!

Wir arbeiten direkt mit Chipsatzanbietern zusammen, um deren Implementierung kommender Funktionen und Dienste zu qualifizieren. Durch die direkte Integration unserer zertifizierten Chipsätze in ihre Hardwareplattform können Hersteller mehr Flexibilität bei der Produktentwicklung erlangen und ihre Produktionskosten senken.

ASR Microelectronics

ASR1603

• 2G/LTE Cat.1bis chipset optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I2C / SDIO
• Ideal for medium and low rate communication solutions
• Support for frequency bands of major operators in Europe
• VoLTE support
• Ultra-low power solutions

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CEVA

Dragonfly

• Best in class NB-IOT modem IP integrated with GNSS receiver
• Supports 3GPP^TM Release 14, Category NB1/NB2
• Supports enhanced coverage modes
• Ultra-low power consumption and tiny footprint to support cost-optimized solutions
• Highly integrated SoC: single die includes RF transceiver, PA, PMU, modem DSP, GNSS, SRAM, embedded Flash
• Release 15 ready with firmware update
• Optional support for: TLS, DTLS, HTTP, MQTT, CoAP, MQTT-SN, LwM2M

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Goodix

GR851X

• 3GPP^TM NB-IoT Rel-14, incl. Rel-15 readiness
• Ultra Low Power Cortex-M4F AP w/ FPU
• Integrated SIM with certified security
• Advanced Communication processing (CP) engine
• Wide range voltage input from 1.7 V to 4.35 V
• OpenCPU solution with MCU-style SDK and tool set

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HiSilicon

Hi2110V120

• Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
• VFBGA (5.3 x 5.3) mm
• Ultra-low power standby mode (typically 12 μW including memory retention)
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Supports 3GPP Rel.13 NB-IoT air interfaces and protocols
• Up to 20 PIOs on up to three (externally provided) supplies
• Dedicated application process with on-chip memory
• Extended temperature range of -40°C to +85°C
• Operates over 698-960 MHz
• UDP/IP
• Non-IP based Small Data over NAS and SMS

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Hi2115V110

• Single-die, SoC chip-integrated MCU/BB/RF/PMU/Flash/SRAM
• 5.8mm x 5.8mm, 121-pin TFBGA
• Up to +20 dB extended coverage compared to GPRS (164 dB MCL)
• Supports 3GPP^TM Rel.13/14 NB-IoT air interfaces and protocols
• 40 configurable GPIOs 
• Operating temp range of -40°C to 85°C
• Standby Power Consumption typically 12uW including memory retention
• Dedicated application process with on-chip memory
• Operates over 698-960 MHz and 1710-2180 MHz
• CoAP over UDP/IP, IPv4/6
• Non-IP based small data over NAS and SMS
• No-harm to network: TS.34 Radio Policy Manager (RPM)

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MediaTek

MT2625

• Industry’s Smallest NB-IoT Module (16 mm x 18 mm) with integrated PMU, Baseband, RF, Modem DSP
• Ultra-low power, 3GPP^TM Release.13/14 (ready) NB-IoT platform for wide-ranging home, civic, industrial or mobile applications
• Single Core ARM Cortex-M (104 MHz), FPU + 4 MB PSRAM + 4 MB NOR Flash
• Global Radio Frequency Support: 450-2100 MHz
• Multi IO Interface support: I2C, I2S, PCM, SDIO, UART
• With a Real time operation system (RTOS), it’s easily customizable for applications such as home automation, cloud beacons, smart metering
• Future-proof with OTA upgrade

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Nurlink Technology

NK6010P1

• Highly integrated, BGA form factor NB-IoT chip (both 3GPP Rel.13 and Rel.14), with ultra-small size: 5.8 mm x 5.4 mm
• Features a light-weight ARM Cortex-M0 application processor, a NB-IoT and GNSS modem DSP subsystem, a low-power RF transceiver, a multi-band RF front end, and power management unit (PMU)
• Designed for low data rates, ultra-low power, long distance, and massive connections of IoT applications
• Versatile network protocols and various low power modes
• Enables IoT devices for a wide range of applications from smart metering, intelligent agriculture, asset tracking, smart wearable devices, to M2M connections

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Qualcomm

MDM9205 TX

• Integrated GNSS Supports GPS, Glonass, BeiDou, Galileo
• Integrated Cortex A7 processor, Supports ThreadX and AliOS Things RTOS
• Hardened Security, Secure boot/debug, storage, key provsioning, Trusted Execution Environment
• One hardware design supporting: eMTC/Cat-M1, NB-IoT/Cat-NB2, E-GPRS
• One software: Image no matter what technology is used
• One RF: Extended frequency range support
• from 450MHz to 2.1GHz supporting >23 global bands

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MDM9206 TX

• Gobal multi-mode connectivity solution for IoT, supporting 15 LTE spectrum bands
• One hardware design, supporting the high reliability, low latency, and voice support of LTE Cat.M1 (eMTC) with the extended coverage and delay tolerance of Cat.NB1 (NB-IoT), together with E-GPRS
• Integrated GNSS (GPS, GLONASS, BeiDou/Compass, Galileo, QZSS)
• Single SKU allowing device manufacturers to support ultra-low power consumption and cost-optimized solutions of carriers/end-users worldwide
• Futureproof with OTA upgrade

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QCX212

• Global single-mode Rel.14 NB2 (NB-IoT) enabling extended coverage for delay tolerant applications
• Ultra-low power with sub 1µA sleep current
• Integrated RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.1GHz
• Integrated ARM Cortex M3 application processor
• Single chip solution includes modem baseband, memory, RF transceiver with fully integrated RF front end, and power management units enabling sub 100sq mm modules
• Comprehensive set of IoT networking protocols

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QCX216

• Global LTE Cat 1bis with a Wi-Fi receiver for indoor positioning
• Ultra-low power with sub 2µA sleep current
• Integrated LTE modem and RF transceiver and RF front end enabling RF frequency bands from 700MHz to 2.6GHz
• Integrated dual core ARM Cortex M3 application processor
• Support for external RF front end like Qualcomm QPA8675 multiband PA
• Support for indoor position location with 2.4 GHz Wi-Fi Scanning capability using a shared RX with LTE
• Comprehensive set of IoT networking protocols

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Sequans

GM01Q

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

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GM02S

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA module form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

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Monarch SQN3330-M1

• Ultra small 20 mm x 21 mm x 1.5 mm LGA form factor
• World-wide band support in a Single SKU^TM design
• Lowest power consumption with 1 microAmp PSM
• eco-Paging^TM for optimized eDRX
• Power class options 20 dBm and 23 dBm
• On-modem location based services

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Monarch 2 SQN3430-M1

• 3GPP^TM LTE Release 14/15 Cat.M1
• New tiny "S" LGA form factor, with single-rail power supply supporting 2.2–5.5V
• Programmable RF filtering for global band support in a Single-SKU design (617 MHz to 2.2 GHz)
• Adaptive output power of +23dBm, +20dBm and +14dBm, for most efficient deep indoor penetration
• Fully tested and calibrated for easy integration into product hardware
• Fully software-compatible with first generation Monarch GM01Q (LTE-M), enabling ease of migration

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Sony Semiconductor

ALT1250

• Cat.M1 and Cat.NB2 supported
• HFDD (Half Duplex FDD) and TDD
• 3GPP^TM Rel.13 features including eDRX, PSM, Enhanced Coverage (EC) Modes A and B
• Integrated voice processing for VoLTE and Voice over the top applications
• Secure boot and a robust hardware-based security framework
• Carrier grade integrated SIM
• OneSKU^TM frequency range 617 - 960 MHz and 1700 - 2200 MHz, optional support for 450 MHz Bands 31, 72, 73
• GNSS technologies: Assisted GPS and GLONASS
• Cellular based location
• Interfaces include: UART (3), SPI, FS USB2.0, USIM(2) or eUICC, I2S/PCM audio, GPIOs, I2C, Auxiliary ADC and PWM
• WLCSP packaging for low cost and small size devices

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ALT1255

• The most integrated, cost optimized NB-IoT chipset with 2G fallback available in the market
• Compliant with 3GPP^TM Rel.13/14 and software upgradeable to Rel.15, enabling a wide set of Cellular IoT features, global coverage, and outstanding performance
• Integrates an LTE baseband processor, RF transceiver, memory, cellular based location engine, MCU subsystem, and a hardware based integrated SIM (iSIM)
• Provides out-of-the-box secure cloud connectivity, using MQTT, COAP and LwM2M
• Enables miniature complete modules of less than 10x10mm, targeted for power and size sensitive applications
• Features ultra-low power consumption in a variety of modes, including PSM and eDRX, for optimized power and over 15 years of battery life in real life applications
• The integrated Cortex M4 MCU in ALT1255 is designed to serve a wide range of customer applications

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Unisoc

IVY8908A

• 3GPP^TM Release 13 NB-IoT specification fully-compliant
• Software upgradeable to support 3GPP^TM Release 14 features
• Wide frequency range of supported RF bands
• Supports all deployment scenarios (standalone, in-band, guard-band), single-tone and multi-tone in uplink
• Supports CP-CIoT and UP-CIoT
• Power saving features, including PSM and eDRX, with multiple SoC low power modes
• Up to 192MHz MIPS processor, integraion 32Mb SPI NOR flash and pSRAM

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IVY8909B

• High performance, highly integrated system-on-chip processor with NB-IoT connectivity and 2G Fallback
• Integrates all essential electronic components, including baseband, multi-band RF transceiver, and a power management unit
• Packed with impressive connectivity for easy scalability of the system, allowing glue less interfaces to camera and multimedia companion chips, SDMMC Memory Cards and SPI devices, LCD modules, and USB
• GPRS Class 12 enabled, and supports Full Rate (FR), Half Rate (HR), Enhanced Full Rate (EFR) voice coders
• Supports simultaneous dual network operation and integrates a SIM controller with integrated level shifters that can support two SIM cards
• Available in a small footprint, fine pitch, 8.5 mm x 9.0 mm TFBGA package

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UIS8910DM

• 2G/LTE Cat.1 bis chipset optimized for M2M and IoT applications
• Universal interfaces such as USB / UART / SPI / I²C / SDIO
• Ideal for medium and low rate communication solution
• Support for frequency bands of major European networks
• Flexible I/O voltage
• Ultra-low power standby solution, embedded power-FSM

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